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Your search returned 16 records. Click on the hyperlinks to view further details of Titles.. |
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Magazine Name : Ieee Transactions On Components Packaging And Manufacturing Technology Part A
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Year : 1995 Volume number : 18 Issue: 04 |
Achiving Accurate Thermal Characterization Using A Cfd Code Case Study Of Plastic Packages
(Article)
Subject:
Computation Fluid Dynamics
,
Modeling
,
Plastic Loads
Author:
Juan
Burgos
P.
Manno
K
Azar
page:
732
-
738
An Assessment Of The Thermal Performance Of The Pbga Family
(Article)
Subject:
Power Dissiption
,
Package Performance
,
System Cooling
Author:
Shailesh
Mulgaonker
B
Chambers
Mali
Mahalingam
page:
739
-
748
Analysis Of A Therally Enhanced Ball Grid Array Package
(Article)
Subject:
Computer Simulation
,
Nonlinear Calculation
,
Convective Heat Transfer
Author:
Bruce M.
Guenin
Ronald J.
Molnar
Robert C.
Marrs
page:
749
-
747
Methodolgy For Thermal Evaluation Of Multichip Modules
(Article)
Subject:
Microelectronics
,
Forced Convection
,
Natural Convection
Author:
Balwant S.
Lall
Bruce M.
Guenin
Ronald J.
Molnar
page:
758
-
764
Thermal Characterization Of Vertical Multichip Modules Mcm-V
(Article)
Subject:
Thermal
,
Thermal Measurement
,
Mcmc
,
Thermal Simulation
Author:
Ciaran
Cahill
John O'
Donovan
Augustin
Coello-Vera
page:
765
-
772
A Methodology For Laser-Thermal Diffusivity Measurement Of Advanced Multichip Module Ceramic Materials
(Article)
Subject:
Thermal Diffusion
,
Laser Flash Diffusivity
,
Photothermal Radiometry
Author:
L.
Kehoe
P. V.
Kelly
G. M.
Crean
page:
773
-
780
Asymptotic Thermal Analysis Of Electronic Packages And Printed-Circuit Boards
(Article)
Subject:
Thermal Simulation
,
Large Thermal Network
,
Asymptotic
Author:
Da-Guang
Liu
Qi-Jun
Zhang
Michel S.
Nakhla
page:
781
-
787
Experimental Investigation Subcooled Liquid Nitrogen Impingement Cooling Of A Silicon Chip
(Article)
Subject:
Electronic Cooling
,
Cryogenics
,
Jet Impingement
Author:
David T.
Vader
Gregory
Chrysler
Robert E.
Simons
page:
788
-
794
High Performance Forced Air Cooling Scheme Empolying Microchannel Heat Exchangers
(Article)
Subject:
Heat Sink
,
Air Cooling
,
Microchannel
Author:
Michael B
Kleiner
Stefan A.
Kuhn
Karl
Haberger
page:
795
-
804
The Evolution Of Ibm High Performance Cooling Technology
(Article)
Subject:
Thermal Management
,
Air Cooling
,
Impingement Channel
Author:
Robert E.
Simons
page:
805
-
811
Optimum Design And Selection Of Heat Sinks
(Article)
Subject:
Design
,
Selection
,
Optimum
Author:
Seri
Lee
page:
812
-
817
Heat-Transfer Engineering In Systems Integration Outlook For Closer Coupling Of Thermal And Electrical Designs Of Computers
(Article)
Subject:
Heat Transfer
,
System Operator
Author:
Wataru
Nakayama
page:
818
-
826
Substrate Temperatures Of Liquid Nitrogen Cooled Multichip Modules Utlizing Wirebonded Die
(Article)
Subject:
Superconductor
,
Mcm
,
Thermal Management
Author:
Richard K.
Ulrich
Sanjay
Rajan
page:
827
-
834
Degradation Of Gold-Aluminium Ball Bonds By Aging And Contamination
(Article)
Subject:
Degradation
,
Gold-Aluminum Bonds
Author:
V.
Koeninger
H. H.
Uchida
page:
835
-
841
Fine Line Thin Dielectric Circuit Board Characterization
(Article)
Subject:
Printed Circuit Board
,
Teflon
,
Skin Effect
Author:
Chi Shih
Chang
page:
842
-
850
Development Of An Inspection Process For Ball-Grid Array Technology Using Scanned-Beam X-Ray Laminography
(Article)
Subject:
Solder-Joint Inspection
,
X-Ray Absorption Spectroscopy
Author:
S. M.
Rooks
page:
851
-
861
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